Tungsten copper alloy combines the advantages of metal tungsten and copper. Among them, tungsten has a high melting point (the melting point of tungsten is 3410°C, the melting point of copper is 1080°C), and the density is high (the density of tungsten is 19.34g/cm3, and the density of copper is 8.89 g/cm3) ; Copper has excellent electrical and thermal conductivity, tungsten copper alloy (general range of composition is WCu7~WCu50) has uniform microstructure, high temperature resistance, high strength, arc ablation resistance, high density; moderate electrical and thermal conductivity, and is widely used in military high temperature materials , Electrical alloys for high-voltage switches, electrical machining electrodes, microelectronic materials, as parts and components are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries. Tungsten copper alloy is used in aerospace for missiles, rocket engine nozzles, gas rudders, air rudders, and nose cones. The main requirements are high temperature resistance (3000K~5000K) and high temperature resistance to air erosion. Copper is mainly used at high temperatures. The perspiration cooling effect formed by volatilization (copper melting point 1083°C) reduces the surface temperature of tungsten copper and ensures the use under extreme conditions of high temperature. Tungsten copper alloy is widely used in high-voltage switch 128kV SF6 circuit breaker WCu/CuCr, and high-voltage vacuum load switch (12kV 40.5KV 1000A), lightning arrester. The high-voltage vacuum switch is small in size, easy to maintain, and has a wide range of applications. Use in flammable, explosive and corrosive environments. The main performance requirements are arc ablation resistance, fusion welding resistance, low cut-off current, low gas content, and low thermionic emission capability. In addition to the conventional macro performance requirements, porosity and microstructure performance are also required. Therefore, special processes are required, and complex processes such as vacuum degassing and vacuum infiltration are required